型号: 厂商: 批号: 封装: |
型号 | 数量 | 厂商 | 批号 | 封装 | 更新时间 |
---|---|---|---|---|---|
AMP01BTC/883 | 78 | N/A | N/A | NA | 22-06-30 |
AMP01FX | 888 | ADI/亚德诺 | N/A | NA | 22-06-30 |
EPM5128JC-1 | 597 | ALTERA | N/A | NA | 22-06-30 |
EPM5128GC | 80 | ALTERA | 99+ | PGA | 22-06-30 |
Q3236I-20N | 50 | QUALCOMM/高通 | 04+ | PLCC | 22-06-30 |
AD736AQ | 65 | ADI/亚德诺 | 1149+ | DIP-8 | 22-06-30 |
LH0042CD | 58 | NS/国半 | N/A | NA | 22-06-30 |
MHF2805SF | 87 | INTERPOINT | N/A | NA | 22-06-30 |
A1280A-1CQ172B | 76 | ACTEL | 00+ | CQFP | 22-06-30 |
MAX8546EUB | 5780 | MAXIM/美信 | 1149+ | SOP | 22-06-30 |
AD524SE/883B | 57 | ADI/亚德诺 | N/A | NA | 22-06-30 |
AD524SD | 507 | ADI/亚德诺 | N/A | NA | 22-06-30 |
4N37 | 67 | F | 93+ | PDIP | 22-06-30 |
AP5054BES5 | 8000 | CHIPOWN | 13+ | SOT-23 | 22-06-30 |
LF355H | 57 | NS/国半 | 8252 | CAN | 22-06-30 |
AM2921DMB | 55 | AMD | 8649 | DIP | 22-06-30 |
BSC090N03LSG | 500 | N/A | 1149+ | NA | 22-06-30 |
MAX1308E | 88 | MAXIM/美信 | 1328+ | PDIP-8 | 22-06-30 |
AD210AN | 800 | ADI/亚德诺 | N/A | NA | 22-06-30 |
SHM-6MM | 76 | DATEL | N/A | NA | 22-06-30 |
LF156J | 56 | NS/国半 | 06+ | DIP-8 | 22-06-30 |
MUX24 | 86 | N/A | N/A | NA | 22-06-30 |
SMAJ5.0A-TR | 7000 | N/A | N/A | NA | 22-06-30 |
CY7C287-45WC | 87 | CYPRESS/赛普拉斯 | 98+ | DIP | 22-06-30 |
HPT372N | 60 | HIGHPOINT | 248 | QFP | 22-06-30 |
DAC1210LCJ-1 | 58 | N/A | N/A | NA | 22-06-30 |
TC74VHC02FT | 6500 | TOSHIBA/东芝 | 1245+ | SOP | 22-06-30 |
ADC1210HD | 78 | NS/国半 | N/A | NA | 22-06-30 |
HDG-0807BD | 60 | ADI/亚德诺 | N/A | NA | 22-06-30 |
DM5440W/883B | 88 | NS/国半 | 8231 | SOP | 22-06-30 |
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